Description
ARCTIC MX-7 Ultimate Performance 4g Thermal Paste
ACTCP00090A
The ARCTIC MX-7 Ultimate Performance Thermal Paste (ACTCP00090A) is a premium thermal interface material designed to improve the heat conduction between your processor and cooling solution. Its dense, viscous formula ensures a consistent and stable thermal bond that fills microscopic surface imperfections between heat sink and processor surfaces, helping maintain lower temperatures under load. The compound is engineered to be electrically non-conductive and non-capacitive, making it safe for use on CPUs, GPUs, and other computing hardware without risk of short circuits.
With a wide operating temperature range from −50 °C to 250 °C, MX-7 is suitable for a broad range of tasks from everyday computing to high-performance and overclocked systems. Its optimized consistency naturally spreads under cooler pressure without the need for manual spreading tools, promoting an even thermal interface with minimal air pockets.
Why It’s a Great Choice
– Optimized heat transfer: The high-fill, viscous formula ensures excellent thermal contact between the heatsink and chip surface for better heat dissipation.
– Safe for all hardware: Being non-conductive and non-capacitive eliminates risk of electrical shorts on sensitive components.
– Wide temperature tolerance: A broad operating temperature range makes it suitable for everyday use up to high-performance systems.
– Easy to use: Designed to spread naturally under cooler pressure — no special tools needed.
– Versatile compatibility: Works with CPUs, GPUs, laptops, consoles, and general processors — ideal for system builders and technicians.
– Compact packaging: Small syringe design lets you apply precisely without waste — suitable for multiple builds or future re-applications.
Specifications:
| Specification | Details |
|---|---|
| Model / SKU | MX-7 Thermal Paste – ACTCP00090A |
| Product Type | Thermal paste / thermal compound |
| Capacity | 4 g syringe |
| Colour | Grey |
| Viscosity | 35 000–38 000 poise |
| Density | 2.9 g/cm³ |
| Operating Temperature | −50 °C to 250 °C |
| Volume Resistivity | 1.7 × 10¹² Ω-cm |
| Breakdown Voltage | ~4.2 kV/mm |
| Thermal Conductivity | Performance-optimized (high-fill formula) |
| Safe Application | Non-electrically conductive, non-capacitive |
| Compatibility | CPUs, GPUs, consoles, laptops, other processors |
| Usage Method | Apply small cross pattern, let cooler pressure distribute |
| Package Dimensions | ~107 × 21 × 13 mm |
| Weight (approx.) | ~12 g |


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