Description
ARCTIC MX-7 Ultimate Performance 8g Thermal Paste
ACTCP00091A
The ARCTIC MX-7 Ultimate Performance Thermal Paste – 8 g (ACTCP00091A) is a high-performance thermal interface compound designed to create an efficient thermal bond between your processor and cooler. Its dense and viscous formula — with a high filler content — ensures excellent surface contact and efficient heat conduction, making it suitable for high-demand systems including gaming PCs, workstations, and overclocked rigs. The compound’s texture naturally spreads into a thin, uniform layer under cooler mounting pressure without manual spreading tools.
This thermal paste is electrically non-conductive and non-capacitive, which reduces the risk of short circuits on sensitive hardware. It’s compatible with a wide range of applications — from desktop CPUs and discrete GPUs to laptops and consoles. With a capacity of 8 g, it offers multiple applications for builders, technicians, and enthusiasts.
Why It’s a Great Choice
– Superior heat transfer: The dense, high-fill formula enhances conduction between heat-generating components and their coolers, aiding in temperature control during high loads.
– Safe for electronics: Being non-conductive and non-capacitive minimizes electrical risk when working near sensitive circuits.
– Wide temperature range: Designed for demanding thermal environments — from everyday use to heavy workloads.
– Easy application: Simple cross-pattern application spreads evenly under cooler pressure without special tools.
– Versatile usage: Compatible with a variety of components including CPUs, GPUs, consoles, and laptops — great for system builds and upgrades.
– Multi-use quantity: With 8 g of paste, there’s enough for multiple installations — useful for system builders or technicians.
Specifications:
| Specification | Details |
|---|---|
| Model / SKU | ACTCP00091A |
| Product Type | Thermal paste / thermal compound |
| Capacity | 8 g syringe |
| Colour | Grey |
| Viscosity | ~35 000–38 000 poise |
| Density | ~2.9 g/cm³ |
| Operating Temperature | −50 °C to 250 °C |
| Volume Resistivity | ~1.7 × 10¹² Ω-cm |
| Breakdown Voltage | ~4.2 kV/mm |
| Thermal Conductivity | Performance-optimized (dense compound) |
| Safe Application | Non-conductive & non-capacitive |
| Compatibility | CPUs, GPUs, consoles, laptops, processors |
| Usage Method | Apply cross pattern, cooler pressure distributes evenly |
| Package Dimensions | ~121 × 26 × 16 mm |
| Weight (Approx.) | ~19.6 g gros |


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