Description
Gigabyte AMD B550 AORUS PRO AX Mini-ITX Motherboard
GA-B550I-AORUS-PRO-AX
Introducing the all-new AORUS PRO AX B550I Motherboard from Gigabyte. Perfect performance for those who prefer a smaller form factor. Filled with the latest technologies to take your gaming experience to the next level such as PCI-E 4.0 technology to give you better performance, bandwidth and eye-watering speeds, incredible Wi-Fi 6 module with BlueTooth 5 module and AORUS antenna, 2x M.2 slots with thermal guards, USB 3.2 gen2 Type C connectivity and a high-quality audio system. Illuminate your system in your own style with Gigabytes RGB Fusion software or even have supported devices be interactive with the new gaming mode to give yourself that additional immersive gaming experience. The AORUS B550I PRO AX is designed to unleash the full potential of the 3rd Generation Ryzen CPUs, give your system the strongest foundations and make your friends and enemies envious of the power you now hold.
AMD B550 Chipset
3rd Generation Ryzen
AM4 CPU Socket
Mini-ITX Form Factor
Advanced Cooling for High-End Systems
In order to guarantee un-throttled performance AORUS have opted for an advanced thermal solution, including Pre-installed IO Armour and enlarged MOSFET heatsink with additional groves to improve airflow, an additional M.2 heatpipe, a multi-layered heatsink for your m.2 SSD and a thermal baseplate for the entire board meaning the B550I PRO AX is capable of keeping the MOSFETs and M.2 SSDs cool and comfortable even under maximum load. Whether you’re a gamer, builder or just an enthusiast you can expect lower temperatures and higher performance from the B550I PRO AX.
1. GROOVED HEATSINK
2. DIRECT TOUCH HEATPIPE
3. MULTI-LAYERED HEATSINK
4. THERMAL BASEPLATE
Intricate Design for Expert Performance
In order to fully support 3rd Generation AMD Ryzen CPUs, the AORUS B550I PRO AX comes equipped with the most complete power solution yet, with true direct, digital and multiple power phases, birthed from countless experiments, testing and tinkering the B550I PRO AX uses a total 6+2 phases for Vcore and SOC, is capable of providing 90A from each phase and a total of 720A power design. With 8 Solid-pin CPU Power Connectors offer incredible precision and stability in delivering power to the motherboard’s most power-hungry and energy-sensitive components, allowing enthusiasts to get the absolute maximum overclocking performance from 3rd Gen AMD Ryzen™ processors.
1. DIGITAL PWM
2. DRIVER MOSFETS
3.ALL-SOLID CAPACITORS
4.CPU POWER CONNECTOR
Handle Demanding Tasks with Ease
Excel your Memory for Strong Performance
nPlease see the complete validated memory support list. Product features may vary by model.
Next Generation Connectivity
Need a Wireless Connection?
Illuminate your PC with Beautiful Colour
Durability for Years to Come
Take Control of your Motherboard
Good software goes hand in hand with perfect hardware. The B550I AORUS PRO has bundled several useful and intuitive softwares to help users to control every feature of the motherboard.
NEW USER INTERFACE
All new EASY MODE shows important hardware information all on one page.
MY FAVORITES
Add constantly used items into the favorite menu for quick access.
STORAGE INFORMATION
Show all kinds of storage information including SATA, PCIE and M.2 interface.
CHANGELOG
List all changes before saving and exiting bios. Quickly review overall settings modification.
INTUITIVE LOAD LINE CURVE
| SPECIFICATIONS | |
| Brand | Gigabyte |
| Series | AMD B550 |
| Model | GA-B550-I-AORUS-PRO-AX |
| CPU | AMD Socket AM4 |
| Chipset | AMD B550 |
| Memory | 2 x DDR4 DIMM sockets supporting up to 64 GB (32 GB single DIMM capacity) of system memory |
| 3rd Gen AMD Ryzen Processors: | |
| Support for DDR4 4866(O.C.)/4600(O.C.)/4400(O.C.)/4000(O.C.)/3600(O.C.)/3333(O.C.)/3200/2933/2667/2400/2133 MHz memory modules | |
| New Generation AMD Ryzen with Radeon Graphics processors: | |
| Support for DDR4 5300(O.C.)/5200(O.C.)/5000(O.C.)/4866(O.C.)/4600(O.C.)/4400(O.C.)/4000(O.C.)/3600(O.C.)/3333(O.C.)/3200/2933/2667/2400/2133 MHz memory modules | |
| Dual channel memory architecture | |
| Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules | |
| Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules | |
| Support for Extreme Memory Profile (XMP) memory modules | |
| Onboard Graphics | Integrated in the New Generation AMD Ryzen with Radeon Graphics processors: |
| 1 x DisplayPort, supporting a maximum resolution of 5120×2880@60 Hz | |
| * Support for DisplayPort 1.4 version, HDCP 2.3, and HDR. | |
| 2 x HDMI ports, supporting a maximum resolution of 4096×2160@60 Hz | |
| * Support for HDMI 2.1 version, HDCP 2.3, and HDR. | |
| Support for up to 3 displays at the same time | |
| Maximum shared memory of 16 GB | |
| Audio | Realtek ALC1220-VB codec |
| * The back panel line out jack supports DSD audio. | |
| High Definition Audio | |
| 2/4/5.1/7.1-channel | |
| * To configure 7.1-channel audio, you have to use an HD front panel audio module and enable the multi-channel audio feature through the audio driver. | |
| LAN | Realtek 2.5GbE LAN chip (2.5 Gbit/1 Gbit/100 Mbit) |
| Wireless Communication Module | Intel Wi-Fi 6 AX200 |
| WIFI a, b, g, n, ac with wave 2 features, ax, supporting 2.4/5 GHz Dual-Band | |
| BLUETOOTH 5 | |
| Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate | |
| * Actual data rate may vary depending on environment and equipment. | |
| Expansion Slots | 1 x PCI Express x16 slot (PCIEX16), integrated in the CPU: |
| 3rd Generation AMD Ryzen processors support PCIe 4.0 x16 mode | |
| New Generation AMD Ryzen with Radeon Graphics processors support PCIe 3.0 x16 mode | |
| Storage Interface | 1 x M.2 connector (M2A_CPU), integrated in the CPU, supporting Socket 3, M key, type 2260/2280 SSDs: |
| – 3rd Generation AMD Ryzen processors support SATA and PCIe 4.0 x4/x2 SSDs | |
| – New Generation AMD Ryzen with Radeon Graphics processors support SATA and PCIe 3.0 x4/x2 SSDs | |
| 1 x M.2 connector (M2B_SB) on the back of the motherboard, integrated in the Chipset, supporting Socket 3, M key, type 2260/2280 SSDs: | |
| – Supporting SATA and PCIe 3.0 x4/x2 SSDs | |
| 4 x SATA 6Gb/s connectors, integrated in the Chipset: | |
| – Support for RAID 0, RAID 1, and RAID 10 | |
| USB | CPU: |
| 4 x USB 3.2 Gen 1 ports on the back panel | |
| Chipset: | |
| 1 x USB Type-C port on the back panel, with USB 3.2 Gen 2 support | |
| 1 x USB 3.2 Gen 2 Type-A port (red) on the back panel | |
| 2 x USB 3.2 Gen 1 ports available through the internal USB header | |
| 2 x USB 2.0/1.1 ports available through the internal USB header | |
| Internal I/O Connectors | 1 x 24-pin ATX main power connector |
| 1 x 8-pin ATX 12V power connector | |
| 1 x CPU fan header | |
| 2 x system fan headers | |
| 1 x addressable LED strip header | |
| 1 x RGB LED strip header | |
| 4 x SATA 6Gb/s connectors | |
| 2 x M.2 Socket 3 connectors | |
| 1 x front panel header | |
| 1 x front panel audio header | |
| 1 x speaker header | |
| 1 x USB 3.2 Gen 1 header | |
| 1 x USB 2.0/1.1 header | |
| 1 x Trusted Platform Module (TPM) header (2×6 pin, for the GC-TPM2.0_S module only) | |
| 1 x Clear CMOS jumper | |
| Back Panel Connectors | 1 x DisplayPort |
| 2 x HDMI ports | |
| 1 x USB 3.2 Gen 2 Type-A port (red) | |
| 4 x USB 3.2 Gen 1 ports | |
| 1 x USB Type-C port, with USB 3.2 Gen 2 support | |
| 1 x Q-Flash Plus button | |
| 1 x RJ-45 port | |
| 2 x SMA antenna connectors (2T2R) | |
| 3 x audio jacks | |
| I/O Controller | iTE I/O Controller Chip |
| H/W Monitoring | Voltage detection |
| Temperature detection | |
| Fan speed detection | |
| Overheating warning | |
| Fan fail warning | |
| Fan speed control | |
| BIOS | 1 x 256 Mbit flash |
| Use of licensed AMI UEFI BIOS | |
| PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0 | |
| Form Factor | Mini-ITX |
| 17.0cm x 17.0cm | |
| Warranty Information | |
| Warranty | 3 Year Warranty |




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