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HIKSEMI FUTURE 512GB M.2 2280 PCIe Gen4 x4 NVMe SSD

R2916.00 Incl. Vat


(Displayed price above applies to EFT / Bank Transfer payments only.)

SKU HS-SSD-FUTURE-512G Categories , , Tags , , , , , ,

KEY FEATURES:

– 512GB capacity in M.2 2280, single-sided

– PCIe Gen4 x4 NVMe interface

– Up to 7,050 MB/s read

– Up to 4,200 MB/s write

– Up to 710K / 640K IOPS (read/write)

– MAXIO MAP1602 controller

– DRAM-less with HMB + SLC cache

– 3D TLC NAND

– Ultra-thin graphene heatsink

– Low power draw (~3.66 W max)

– Endurance: 900 TBW; MTBF: 2,000,000 hours

– AES encryption, LDPC, S.M.A.R.T., TRIM, GC

– Operating temp: 0–70 °C

– 5-Year limited warranty

Description

HIKSEMI FUTURE 512GB M.2 2280 PCIe Gen4 x4 NVMe SSD

HS-SSD-FUTURE-512G

The FUTURE 512GB is a Gen4 x4 NVMe upgrade delivering up to 7050 MB/s read and 4200 MB/s write. It uses a MAXIO MAP1602 controller with DRAM-less HMB + SLC cache, 3D TLC NAND, a slim graphene heatsink, and a single-sided PCB for easy fitment under motherboard shields. Rated 900 TBW endurance, 2.0M-hour MTBF, and a 5-Year limited warranty.

Key Features

  • 512GB capacity in M.2 2280 form factor

  • PCIe Gen4 x4 NVMe interface

  • Up to 7050 MB/s sequential read; 4200 MB/s sequential write

  • Up to 710K / 640K random 4K IOPS (read/write)

  • MAXIO MAP1602 controller; DRAM-less with Host Memory Buffer & SLC cache

  • 3D TLC NAND; ultra-thin graphene heatsink, single-sided design

  • Max power consumption ~3.66 W

  • Endurance 900 TBW; MTBF 2,000,000 h

  • Features: AES encryption, LDPC, S.M.A.R.T., GC, RAID engine

Why It’s a Great Choice — HIKSEMI FUTURE 512GB

  • Gen4 x4 speeds (up to 7,050/4,200 MB/s) make OS boots, game loads, and large file moves feel instant

  • Single-sided PCB with ultra-thin graphene heatsink fits under tight motherboard shields and in slim laptops

  • DRAM-less MAP1602 + HMB design delivers strong real-world performance at a sharp price point

  • Robust endurance (900 TBW) and 5-Year warranty for long-term peace of mind

  • Low max power (~3.66 W) helps keep temps in check and battery drain low

  • Backward-compatible with PCIe Gen3 systems (at Gen3 speeds), so it’s an easy drop-in upgrade

Specifications:

Item Details
Brand / Series HIKSEMI FUTURE
Model HS-SSD-FUTURE-512G
Capacity 512GB
Form Factor M.2 2280 (22 × 80 mm), single-sided
Interface / Protocol PCIe Gen4 x4, NVMe
Controller MAXIO Technology MAP1602
NAND 3D TLC
Heatsink Ultra-thin graphene
DRAM None (HMB + SLC cache)
Sequential Read Up to 7050 MB/s
Sequential Write Up to 4200 MB/s
Random 4K Read Up to 710K IOPS
Random 4K Write Up to 640K IOPS
Endurance (TBW) 900 TB
MTBF 2,000,000 hours
Power (Max) ~3.66 W
Operating Temp 0–70 °C
Storage Temp –40–85 °C
Weight ~7 g
Security / Features AES FDE, LDPC, S.M.A.R.T., GC, RAID engine, Host Memory Buffer
OS Support Windows 10+/Linux
Warranty 5-Year limited

Additional information

Weight 0.2 kg
SSD Brand

SSD Capacity

SSD Form Factor

SSD RGB

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